FLAME RETARDANT RESIN COMPOSITE

摘要

Provided is a flame resistant resin composition, which has a controllable curing degree while maintaining excellent mechanical properties such as mechanical strength, is free from halogen, and is useful for fabricating a printed circuit board via imprinting lithography. The flame resistant resin composition comprises: (a) 100 parts by weight of a composite epoxy resin comprising 1-40 parts by weight of a bisphenol A type epoxy resin, 1-30 parts by weight of a phenol novolac epoxy resin, 1-10 parts by weight of a cresol novolac epoxy resin, 1-20 parts by weight of a rubber-modified epoxy resin and 1-50 parts by weight of a phosphor-based epoxy resin; (b) a curing agent mixed at an equivalent ratio of 1:1 to the combined epoxy equivalent of the composite epoxy resin; (c) 0.1-1 parts by weight of a curing accelerator; and (d) 10-50 parts by weight of inorganic fillers.