发明名称 Ceramic circuit board
摘要 <p>A ceramic circuit board comprising: a ceramic substrate and a metal circuit plate bonded to said ceramic substrate through a brazing material layer; wherein said brazing material layer is composed of Al and an alkaline earth metal element or compound thereof and the amount of Al and an alkaline earth metal element or compound thereof contained in the brazing material layer is 12 wt% or less.</p>
申请公布号 EP1722411(A2) 申请公布日期 2006.11.15
申请号 EP20060013121 申请日期 2000.09.27
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NABA, TAKAYUKI;KOMORITA, HIROSHI;NAKAYAMA, NORITAKA;IYOGI, KIYOSHI
分类号 H01L23/373;H05K1/09;H01L23/13;H05K1/02;H05K1/03;H05K3/38;H05K3/46 主分类号 H01L23/373
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