发明名称 |
Ceramic circuit board |
摘要 |
<p>A ceramic circuit board comprising: a ceramic substrate and a metal circuit plate bonded to said ceramic substrate through a brazing material layer;
wherein said brazing material layer is composed of Al and an alkaline earth metal element or compound thereof and the amount of Al and an alkaline earth metal element or compound thereof contained in the brazing material layer is 12 wt% or less.</p> |
申请公布号 |
EP1722411(A2) |
申请公布日期 |
2006.11.15 |
申请号 |
EP20060013121 |
申请日期 |
2000.09.27 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NABA, TAKAYUKI;KOMORITA, HIROSHI;NAKAYAMA, NORITAKA;IYOGI, KIYOSHI |
分类号 |
H01L23/373;H05K1/09;H01L23/13;H05K1/02;H05K1/03;H05K3/38;H05K3/46 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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