发明名称 |
HOUSING FOR HIGH PERFORMANCE COMPONENTS |
摘要 |
<p>A housing can be used for high-power components, especially high-power capacitors. A housing has a carrier platform made from a suitable electrically insulating material and a preferably metallic cover, wherein the thermal expansion coefficients of the platform and of the cover are matched to each other. This matching is achieved according to the invention by adjusting the glass-fiber coefficient of a fiber-composite material.</p> |
申请公布号 |
EP1721325(A1) |
申请公布日期 |
2006.11.15 |
申请号 |
EP20050706766 |
申请日期 |
2005.02.18 |
申请人 |
EPCOS AG |
发明人 |
VETTER, HARALD;BERG, LUDWIG;HUEBSCHER, WILHELM |
分类号 |
H01G2/02;H01G2/04;H01G2/10;H01G4/38;H01L23/02;H05K5/00 |
主分类号 |
H01G2/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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