| 摘要 |
<p>Embodiments of the present invention improve upon component level inspection performed by pick and place machines (201, 10). Such improvements include measuring the travel of a pick and place machine placement nozzle (210) and the motion characteristics of the workpiece (203) through the placement process. Since the component (104) is placed on the workpiece (203) with some force to ensure proper adhesion to the workpiece (203), some deflection of the workpiece (203) is expected during the placement cycle. The placement force is adjusted to ensure that the component (104) is safely placed into the solder paste or adhesive. Placement force is adjusted through a number of characteristics including: choice of spring tension in the nozzle (210); the length of the nozzle (210) and the amount of over-travel into the board (203); the rigidity of the board (203) and design; and the placement of the board support mechanism (202, 204). With proper adjustment of these characteristics and parameters, high quality placements onto the workpiece (203) can be ensured. To properly adjust these parameters, a method of measuring the workpiece (203) motion and nozzle (210) travel is provided.</p> |
