INTERPOSER SUBSTRATE HAVING A PLURALITY OF METAL LANDS, AND STACKED CHIP PACKAGE HAVING INTERPOSER MANUFACTURED FROM THE SAME

摘要

An interposer substrate having a plurality of metal lands is provided to fabricate a general-purpose interposer regardless of a variable condition for fabricating a stack chip package by enabling an electrical connection of a semiconductor chip and a package board that are stacked while using a plurality of metal lands as a medium. An interposer substrate(100) comprises a base substrate and a plurality of metal lands(120). The plurality of metal lands are formed all over one surface of the base substrate. All of the plurality of metal lands have the same type and size. A straight distance(pitch) between the centers of adjacent two metal lands of the plurality of metal lands is the same. The pitch has a size by which one metal land is short-circuited with another metal land separated from the one metal land by a predetermined pitch by one end part of one connection member when an end of the connection member is bonded to the one metal land among the plurality of metal lands. The plurality of metal lands are arranged as a lattice type all over one surface of the base substrate.