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发明名称
ENVELOPE FOR MAILING OF CARDS CONTAINING AN EMBEDDED CHIP
摘要
A new mailing envelope for use in mailing of a rigid module that is embedded in a plastic or non-plastic substrate.
申请公布号
CA2507062(A1)
申请公布日期
2006.11.10
申请号
CA20052507062
申请日期
2005.05.10
申请人
THE DIRECTV GROUP, INC.;METACA CORPORATION
发明人
TADMAN, ALAN;TORRES, PELEGRIN, JR.;ASIMAKIS, CHRIS;APPLETON, WILLIAM J.
分类号
B65D27/00;B65D27/14
主分类号
B65D27/00
代理机构
代理人
主权项
地址
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