发明名称 |
METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, CIRCUIT BOARD, ELECTROOPTIC DEVICE, AND ELECTRONIC DEVICE |
摘要 |
<p>A method of forming a bonded structure comprises the steps of: mounting a semiconductor device having an electrode; a convexity protruding higher than the electrode and formed of a resin; and a conductive unit electrically coupled to the electrode and extending over the surface of the convexity, onto a specific substrate with an intermediary of a bonding material; and mounting the semiconductor device by hot pressing within a temperature range including the glass transition temperature of the resin.</p> |
申请公布号 |
KR100643984(B1) |
申请公布日期 |
2006.11.10 |
申请号 |
KR20050034362 |
申请日期 |
2005.04.26 |
申请人 |
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发明人 |
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分类号 |
H01L21/60;G09F9/00;H01L21/603;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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