| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink mounting structure for reliably mounting and fixing a heat sink of a heat generating component to a small space. SOLUTION: The heat sink mounting structure is constituted with a heat generating component 2 mounted to a printed circuit board 3, a fin 10, and a U-shape fixing tool 11 for supporting the heat generating component 2. A screw 15 is sequentially inserted into a mounting hole of a fixing tool 11 and a mounting hole of a package body 5 and is then screwed to the threaded hole of the fin 10. Accordingly, the fin 10 is tightened to the heat generating component 2 and the fin 10 is then mounted and fixed to the fixing tool 11 via the heat generating component 2. Since the fin 10 and the fixing tool 11 are individually independent of each other, the fin 10 is minimized in size as required, and the fixing tool 11 can be formed in the compact size, the fin 10 mounted to the heat generating component 2 can surely be mounted and fixed into a small space. COPYRIGHT: (C)2007,JPO&INPIT
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