Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process

摘要

A method of monitoring surface status and life of a pad by detecting temperature of a polishing interface during a CMP process. The method include the steps of preparing and placing a brand-new pad under an artificially controlled environment for several CMP tests until termination of its operational life to conclude a relationship between the last stable temperature-rise at a polishing trace during the CMP process and surface roughness of the pad. Then conducting a polishing test of a subject pad under an artificially controlled environment to conclude a relationship between the last stable temperature-rise at a polishing trace during the CMP process and surface roughness of the subject pad. Comparing the two relationships indicated in the aforesaid two steps for analysis to monitor the surface status and operational life of the subject pad.