| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To keep a moistureproof environment of a tape and a reel. <P>SOLUTION: In a manufacturing method of a semiconductor device, a carrier tape 2 joined to a cover tape 3 having an aluminum layer, equipped with a plurality of pockets 2a and made of a polymer material, and a reel taking up the carrier tape 2, are provided. A seal 6 formed by heat-sealing is formed to be connected around the pocket 2a. Thus, the open air outside the seal 6 does not enter the interior of the seal 6, so that the pocket 2a is hermetically sealed, to keep the moistureproof environment of the tape and the reel. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
