SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND METHOD OF CONNECTING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To connect circuit boards together efficiently with high accuracy and reliability. SOLUTION: The board 180 provided with a positioning hole 182 and the cut strip 199 of a flexible tape provided with a positioning hole 192 are made to overlap each other so as to make the one surface of the board 180 face the one surface of the cut strip 199, through a positioning process of making a positioning pin 201 penetrate through the positioning holes 182 and 192. Then, an inner terminal 111 provided to the board 108 and an inner terminal 122 provided to the cut strip 199 are joined together by ultrasonic bonding through a process of pressing an ultrasonic tool 210 against the other surface of the cut strip 199. By this setup, the board 180 and the cut strip 199 can be joined together with high accuracy. The inner terminals 111 and 122 are joined together by ultrasonic bonding, so that working hours are prevented from being lengthened proportionally to the number of terminals in such a case that bonding wires are used for connection, and misalignment caused by heat hardly occurs. COPYRIGHT: (C)2007,JPO&INPIT