| 摘要 |
A drying apparatus under reduced pressure for a plastic molding material. The apparatus comprises a drying hopper provided with an airtight material charge valve capable of containing gas therein at its upper portion and a material discharge valve at its lower portion, and connected to a vacuum pump via vacuum piping, a heating means of thermal conduction type provided in the drying hopper, and a plastic material adherence preventing means in which a gas charge port connected to a gas tank storing gas via a gas changeover valve is provided between the material discharge valve and the drying hopper and stored gas is fed into the drying hopper by opening the gas changeover valve after predetermined time, thereby preventing adherence of plastic molding material.
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