发明名称 |
Circuit board and process for producing the same |
摘要 |
In the case of using a photosensitive insulating resin for a surface protective layer of a circuit wiring pattern, or for an insulating layer between circuit wiring conductor layers in a circuit board, Na ions adsorbed on the photosensitive insulating resin are replaced with a polyvalent metal through a treatment step containing Na ions which is executed after a heat curing step of the photosensitive insulating resin. For the polyvalent metal, a II group including Mg or Ca can be selected.
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申请公布号 |
US2006249304(A1) |
申请公布日期 |
2006.11.09 |
申请号 |
US20050554660 |
申请日期 |
2005.10.24 |
申请人 |
TANAKA HIDEAKI;SENSUI NOBUYUKI |
发明人 |
TANAKA HIDEAKI;SENSUI NOBUYUKI |
分类号 |
H05K1/03;H05K3/28;H05K3/00;H05K3/26;H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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