| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which is excellent in connection reliability and capable of surely and electrically connecting each electrode bump of a wiring substrate with each connection pad of a circuit substrate over a long period of time. <P>SOLUTION: The electronic device 99 is provided with the wiring substrate 3 in which the electrode bumps 2 respectively electrically connected with a wiring conductor 4 are provided to the lower face of an insulating base body 1 having the wiring conductors 4, and the circuit substrate 14 with holes 11a on the upper face of an insulating substrate 11 in which the connection pads 12 electrically connected with the electrode bumps 2 are respectively provided to the bottom face of each hole 11a. The electrode bump 2 is electrically connected with the connection pad 12 by inserting the lower region of the electrode bump 2 to the hole 11a, and also, by joining the insertion to the connection pad 12 via a conductive connection material 20. <P>COPYRIGHT: (C)2007,JPO&INPIT |
