| 摘要 |
PROBLEM TO BE SOLVED: To provide a siloxane polyimide soluble in an ordinary organic solvent, and showing distinguished heat-resistant adhesiveness when used as a main component of an adhesive for bonding a base material and a copper foil of a flexible printed substrate. SOLUTION: The solvent-soluble siloxane polyimide comprises a copolymer obtained by the reaction of a diaminopolysiloxane (95-5 mol%) -1,3-bis(aminomethyl)cyclohexane (5-95 mol%) mixture and an aromatic tetracarboxylic acid dianhydride. The resulting siloxane polyimide forms a heat-resistant adhesive by the addition of an epoxy resin, a diamine-based curing agent and an organic solvent thereto. COPYRIGHT: (C)2007,JPO&INPIT
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