MOUNTING METHOD BY IMAGE RECOGNITION

摘要

A mounting method wherein a chip is aligned with a substrate by recognizing an alignment mark of the chip and an alignment mark of the substrate prior to mounting by a recognizing means and a protruding electrode of the chip is bonded with an electrode of the substrate. The alignment mark of the chip is recognized by image by the recognizing means, then, the appearance of the protruding electrode formed at a prescribed position from the alignment mark of the chip is recognized by image by the recognizing means. The Coordinates of the position of the protruding electrode are calculated, a quantity of positional shift from the alignment mark of the protruding electrode is corrected, and the chip is bonded with the substrate. Desired excellent bonding can be performed even when the position of the protruding electrode of the chip is not at the center of the electrode of the chip.