发明名称 LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus where, even if there is variation in the thickness of a planar work, the desired position in the work can be efficiently machined. <P>SOLUTION: The laser beam machining apparatus is equipped with condensing point position regulation means of moving the condensing points produced by the condenser to the direction vertical to the work holding face. The apparatus is further equipped with: a height position detection means of detecting the height position in the application region of the laser light applied from the condenser in the upper face of the work held to the chuck table; and a control means of controlling the condensing point position regulation means based on a height position signal. The height position detection means is equipped with: a laser light emission means for applying a first and a second laser beam at a prescribed interval each in the front and the rear in the work feeding direction; a laser light reception means with a light position detection element for receiving the first and the second laser beams that are emitted from the laser light emission means and specular-reflected on the upper face of the work; and a selection means for selecting the first and the second laser beams received by the laser light reception means. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006305576(A) 申请公布日期 2006.11.09
申请号 JP20050127380 申请日期 2005.04.26
申请人 DISCO ABRASIVE SYST LTD 发明人 NOMARU KEIJI
分类号 B23K26/04;B23K26/067;B23K26/08;B23K26/10;B23K101/40;H01L21/301 主分类号 B23K26/04
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