| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can suppress cost increase and allows easy conveyance of miniaturized semiconductors. <P>SOLUTION: A semiconductor chip is prepared (step 1), and is mounted in a base frame (step 2). Then, the semiconductor chip is resin-sealed (step 3), and a terminal for external connection capable of electrically connecting the semiconductor chip with the outside is formed on the base frame (step 4). In a mounted state to the base frame, various tests including a low-temperature test of the semiconductor chip are performed (steps 5-7). After various tests, each semiconductor chip is divided every package (step S8), and visual inspection is performed (step S9). <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
