发明名称 SOLVENT FOR REMOVING RESIST PROTECTION FILM USED IN IMMERSION EXPOSURE PROCESS, AND METHOD FOR FORMING RESIST PATTERN USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a solvent for removing a protection film to remove a resist protection film forming material suitably used in a liquid immersion exposure process and to form a high resolution resist pattern by a liquid immersion exposure by using the solvent in a liquid immersion exposure process, in particular, a liquid immersion exposure process of exposing a resist film to lithographic exposure light while a liquid of a predetermined thickness having a refractive index higher than that of air and lower than that of the resist film is present on at least the resist film in the path of the lithographic exposure light reaching the resist film, so as to improve the resolution of a resist pattern, and to form a resist pattern with high resolution by liquid immersion exposure. <P>SOLUTION: The solvent for removing a protective film is used to remove a resist protection film forming material suitably used in a liquid immersion exposure process, and the solvent contains a fluorine-based solvent. The protection film is removed by using the above solvent for removing a resist protection film for a liquid immersion process-use. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006309257(A) 申请公布日期 2006.11.09
申请号 JP20060163937 申请日期 2006.06.13
申请人 TOKYO OHKA KOGYO CO LTD 发明人 HIRAYAMA HIROSHI;TAKASU RYOICHI;SATO MITSURU;WAKIYA KAZUMASA;YOSHIDA MASAAKI;TAMURA KOKI
分类号 G03F7/38;H01L21/027 主分类号 G03F7/38
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