发明名称 |
A METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD |
摘要 |
A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer.
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申请公布号 |
US2006251873(A1) |
申请公布日期 |
2006.11.09 |
申请号 |
US20060379744 |
申请日期 |
2006.04.21 |
申请人 |
WU CHIA-HUI;CHENG PAI-SHENG;WANG HUNG-YI |
发明人 |
WU CHIA-HUI;CHENG PAI-SHENG;WANG HUNG-YI |
分类号 |
B32B3/00;B32B7/00 |
主分类号 |
B32B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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