| 摘要 |
A processing method and apparatus using a laser beam, which can expel as much debris, produced upon application of a laser beam, as possible out of a workpiece to minimize the debris remaining on side surfaces of grooves. The processing method and apparatus superpose a first laser beam ( 30 A) having a width D 1 of a focal spot, and a second laser beam ( 30 B) having a focal spot ( 32 B) upstream, in a beam advancing direction, of the focal spot of the first laser beam, and having a width D 2 of a beam spot at the focal spot of the first laser beam, D 2 being larger than D 1 (D 2 >D 1 ); and apply the superposed laser beams to the workpiece.
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