| 发明名称 |
CONDUCTOR PASTE, MOLDED BODY, AND WIRING BOARD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductor paste capable of suppressing dispersion of a metal element from the conductor paste, and to provide a molded body and a wiring board. <P>SOLUTION: The conductor paste contains a complex metal powder 3 in which a metal oxide 3b of a thickness of≥10 nm is formed on the surface of each of metal particles 3a, a glass powder 5, and a resin 7. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
| 申请公布号 |
JP2006310340(A) |
申请公布日期 |
2006.11.09 |
| 申请号 |
JP20050127393 |
申请日期 |
2005.04.26 |
| 申请人 |
KYOCERA CORP |
发明人 |
AZUMA TOSHIFUMI;FUKUDA KENJIRO;FURUKUBO YOJI |
| 分类号 |
H05K1/09;H01B1/00;H01B1/22;H05K3/46 |
主分类号 |
H05K1/09 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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