发明名称 DIE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a die device for performing a prescribed punching work on a thin plate material, by which the dimension of a punched hole formed on the thin plate material by the punching work is easily corrected. SOLUTION: A pin 37 for performing the punching work while drawing a thin plate material 1 is fixed to an upper die punch 33. The front end shape of the pin 37 is made spherical so as to easily draw the thin plate material 1. The dimension of a punched hole 47, formed on the thin plate material 1 by the punching work, is corrected by adjusting the projection amount of the pin 37, by which the pin is projected from the punching part of the lower end of the punch 33. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006305585(A) 申请公布日期 2006.11.09
申请号 JP20050129283 申请日期 2005.04.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORITA HIDEO
分类号 B21D28/34;B21D28/26 主分类号 B21D28/34
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