System and method for electrostatic discharge protection in an electronic circuit

摘要

A system and method for electrostatic discharge (ESD) protection of a PCB 200 or IC includes an ESD protection element 210 having first and second conductive layers 210c, 210d separated by a semi-conductive dielectric layer 212. The semi-conductive dielectric layer 212 is preferably a polymeric material having a variable conductivity upon application of an ESD surge. A protected node 220 is electrically coupled to the first conductive layer 210c and a current-shunt node 241 is electrically coupled to the second conductive layer 210d. A signal at the protected node 220 that is below a threshold magnitude propagates through the protected node 220 in a normal operating path. A signal at the protected node 220 above a threshold magnitude is diverted through the semi-conductive dielectric 212 to the current-shunt node 241. Thus existing layers of a PCB 200 or IC are used for ESD protection and other functions such as ground planes or battery planes.