Enhanced die-up ball grid array packages and method for making the same

摘要

An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. An IC die is mounted to the first substrate surface. A plurality of solder balls is attached to the second substrate surface. A thermal connector is mounted to the second substrate surface. The thermal connector is configured be coupled to a printed circuit board.