Digital semiconductor based smart surface

摘要

A smart surface is composed of a semiconductor memory layer overlaid on an insulated conductive layer with a one to one correspondence of each memory cell with the conductive pad on the insulated layer. The entire structure can be fashioned into a either a planar structure or other geometric structure. An appliance may be overlaid the smart surface and signals transmitted and received to and from the appliance via the conductive pad(s) of the smart surface.