发明名称 CMOS well structure and method of forming the same
摘要 A method for forming a CMOS well structure including forming a plurality of first conductivity type wells over a substrate, each of the plurality of first conductivity type wells formed in a respective opening in a first mask. A cap is formed over each of the first conductivity type wells, and the first mask is removed. Sidewall spacers are formed on sidewalls of each of the first conductivity type wells. A plurality of second conductivity type wells are formed, each of the plurality of second conductivity type wells are formed between respective first conductivity type wells. A plurality of shallow trench isolations are formed between the first conductivity type wells and second conductive type wells. The plurality of first conductivity type wells are formed by a first selective epitaxial growth process, and the plurality of second conductivity type wells are formed by a second selective epitaxial growth process.
申请公布号 US7132323(B2) 申请公布日期 2006.11.07
申请号 US20030713447 申请日期 2003.11.14
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HAENSCH WILFRIED;HOOK TERENCE B.;HSU LOUIS C.;JOSHI RAJIV V.;RAUSCH WERNER
分类号 H01L21/76;H01L21/8238;H01L27/08;H01L27/092;H01L29/78 主分类号 H01L21/76
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