| 摘要 |
A method ( 100 ) of attaching a shield ( 52 or 82 ) to a substrate ( 40 ) can include the steps of circumscribing a predetermined area on the substrate with a metallized trace pattern ( 26 ), applying ( 101 ) solder to the metallized trace pattern, and optionally placing ( 103 ) components ( 22 and 27 ) on portions of the metallized trace pattern. The method can further include the steps of reflowing ( 104 ) the solder to form a selective cladded trace pattern ( 32 or 62 ) on a portion of the metallized trace pattern reserved for the shield, placing ( 108 ) the shield on the cladded trace pattern, and reflowing ( 109 ) the substrate.
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