Method for holding of semiconductor device by chemical mechanical polishing,申请号KR20010006245-传众专利搜索

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发明名称	Method for holding of semiconductor device by chemical mechanical polishing
摘要
申请公布号	KR100641086(B1)	申请公布日期	2006.11.06
申请号	KR20010006245	申请日期	2001.02.08
申请人		发明人
分类号	H01L21/304	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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