| 摘要 |
A compact and simple lapping apparatus in which, even if projections and depressions are formed in the circumferential direction on the top surface of a lapping plate, a workpiece and a bar are hard to damage and the polished surface of the workpiece is kept in good condition. This apparatus is provided with at least one lapping jig in which a workpiece is placed on the rotating top surface of the lapping plate. Further, a lapping head adapted to be able to rotate only in a direction on the lapping plate is attached to this lapping jig. This lapping head is equipped with a workpiece and at least two dummy work materials (or stock) so that these dummy works compose (as-polished) surfaces, which should be polished, together with the workpiece. Moreover, a device for detecting the remaining part of the workpiece to be lapped is provided on the workpiece. Furthermore, this lapping apparatus is configured so that a detection signal, which represents the detected remaining part of the workpiece and is outputted from the rotating lapping head, is sent to and a correction signal is sent from a control unit to the lapping correction device through a slip ring. A workpiece is polished while rotated on the lapping plate. Thus, the polished surface of the workpiece is kept in good condition. |
