PREPREG SHEET, METAL-FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING MULTILAYER PRINTED BOARD USING THEM

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed board capable of manufacturing a multilayer printed board excellent in solder heat resistance with high production efficiency, and to provide a prepreg sheet, a metal-foil-clad laminate and a circuit board for use in the manufacture of the multilayer printed board.

SOLUTION: The prepreg sheet comprises a fiber sheet and a curable resin composition impregnated in the fiber sheet, wherein a cured product of the curable resin composition has a storage modulus at 20°C of 100-2,000 MPa.

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