| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component attaching structure which can execute highly dense attaching, and is small and inexpensive. SOLUTION: This electronic component attaching structure is provided with an electronic component 3 having a main body 4 and a plurality of terminals 5 consisting of a metallic plate protruding from the main body 4 to the outside, and a circuit board 1 having a plurality of lands 2a for soldering the terminals 5. Since each of the terminals 5 has an inclined portion 5a in an inclined state to the bottom surface 4b of the main body 4 and the terminals 5 are each soldered to the lands 2a at positions of the inclined portion 5a, each of the lands 2a opposing the inclined portion 5a has a small width, intervals between the lands 2a can be reduced, and the electronic component 3 can be attached highly densely, and thus, the circuit board 1 can be miniaturized. COPYRIGHT: (C)2007,JPO&INPIT
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