发明名称 POLYAMIDE RESIN COMPOSITION AND ITS PREPARATION METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a polyamide resin composition which has improved chemical resistance with excellent thermal properties inherent in a polyamide resin. SOLUTION: The polyamide resin composition comprises (a) 50-99 wt.% of a polyamide resin and (b) 1-50 wt.% of a polyolefin resin, and has a resin phase-separation structure observed under electronic microscopy, wherein the polyamide resin (a) forms a continuous phase and the polyolefin resin (b) forms a dispersed phase, and the polyolefin resin (b) is dispersed in a state wherein the resin particles have a dispersed particle size of 1-100 nm. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006299216(A) 申请公布日期 2006.11.02
申请号 JP20050163822 申请日期 2005.06.03
申请人 TORAY IND INC 发明人 HAMAGUCHI MITSUSHIGE;AKITA MASARU;MATSUOKA HIDEO
分类号 C08L77/00;C08L23/00 主分类号 C08L77/00
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