| 摘要 |
PROBLEM TO BE SOLVED: To easily recognize the size of a bubble 13 generated between an integrated circuit chip (IC) 1 and a film substrate 4. SOLUTION: A wiring substrate 20 has at least the film substrate 4 and a first wiring pattern 30 formed on one surface of the film substrate 4. A connection terminal 32 is formed on the end of the first wiring pattern 30, and the bump 2 of the IC 1 is connected to the connection terminal 32, thereby mounting the IC 1 on the wiring substrate 20. The wiring substrate 20 has a bubble measurement pattern formed on the other surface of the film substrate 4 and formed in a mounting region of the IC 1. The bubble measurement pattern consists of a film 6 having a plurality of openings 8 arranged in matrix. COPYRIGHT: (C)2007,JPO&INPIT |
