| 摘要 |
In a pressure bonding mechanism having a configuration in which a first pressure bonding tool 21 A and a second pressure bonding tool 21 B mounted on elevating rods 18 A and 18 B are elevated by a common numerically-controllable tool elevating mechanism 16 through an engagement member 17 so that pressure is applied to the pressure bonding tools by a first air cylinder 19 A and a second air cylinder 19 B respectively, the height positions of the pressure bonding surfaces of the first pressure bonding tool 21 A and the second pressure bonding tool 21 B in the state where the elevating rods 18 A and 18 B are in engagement with the engagement member 17 so as to regulate the lower limit positions of the elevating rods 18 A and 18 B are made different from each other. Thus, the pressure bonding tools can be brought into contact with substrates in turn respectively. It is therefore unnecessary to provide high-precision and high-cost elevating means individually for the pressure bonding tools.
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