| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a transparent display using a light emitting diode (LED). <P>SOLUTION: A method of manufacturing a transparent LED device comprises a step of providing a series of conductive paths 16, 20, and 30 on a transparent underlayer 15; a step of connecting the conductive paths to electronic control means; and a step of associating an array of LED sources addressable individually or in groups with the underlayer 15 through the conductive paths. The LED sources are integrated into the form of a chip, which is an element obtained without a package by dividing a semiconductor wafer through technologies of the chip-on-board type. The method intends to use a flip-chip technique for die bonding, that is, electrical connection of the chip 10 to the underlayer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
