| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sealing material for a semiconductor which is excellent in formability and is satisfactory in reliability at a high temperature, resistance to thermal shock and low dielectricity, and which has a high glass transition temperature (Tg). <P>SOLUTION: This epoxy resin composition for sealing a semiconductor comprises as essential components (A) an epoxy resin, (C) an inorganic filler, (D) a curing accelerator comprising an addition compound of a tertiary phosphine and a benzoquinone, (E) a compound having, in one molecule thereof, two or more maleimide groups, and (F) a phenolic compound having, in one molecule thereof, one or more alkenyl groups. This epoxy resin composition for sealing a semiconductor not only is excellent in formability, but also has a high glass transition temperature and, from this epoxy resin composition, a cured product having a low dielectric constant can be obtained. Further, a semiconductor device sealed with a cured product of this epoxy resin composition is excellent in reliability at a high temperature, reliability at a high humidity, and resistance to thermal shock. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
