| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of inspecting a wafer to automatically detect and correct a defective image generated during the imaging of the wafer. SOLUTION: The method of inspecting a surface of a wafer includes a step of recording a wafer image, a step of automatically evaluating the image, a step of automatically recording a wafer image again as necessary depending upon the evaluation result, and a step of evaluating the image for the inspection of the wafer. A wafer image photographed by a camera is evaluated according to the quality of the photographed image. Before the wafer is evaluated by the evaluation of the image, a wafer image is photographed again as necessary. COPYRIGHT: (C)2007,JPO&INPIT
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