| 摘要 |
PROBLEM TO BE SOLVED: To achieve a good electric connection between a plurality of leads of a semiconductor IC and a plurality of contacts of an IC socket, even when the plurality of leads are irregular in size due to warping of some of the contacts of the IC socket, unevenness of some of the leads of the semiconductor IC, or the like. SOLUTION: The IC socket is provided with a substrate with a plurality of contacts implanted at given intervals electrically connected with a plurality of leads of the semiconductor IC, a pressing lid for pressing the semiconductor IC onto the substrate by closing, a plurality of leaf springs implanted at the same interval as the plurality of contacts on an inner upper-part face of the lid opposed to the substrate, and a plurality of partitioning plates made of an insulating material implanted between the respective plurality of leaf springs. COPYRIGHT: (C)2007,JPO&INPIT
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