| 摘要 |
A semiconductor device is provided to be easily and high reliably connected to a plurality of chip electrodes on a semiconductor chip by electrically connecting each one of first chip electrodes to a corresponding one of a plurality of lead parts. An insulation substrate(14) is disposed in a case(12). A plurality of semiconductor chips have a first chip electrode through which control current flows, mounted on the insulation substrate. A flexible substrate(34) includes a main body part and a plurality of lead parts(36) extended from the main body part. Each one of the first chip electrodes is electrically connected to a corresponding one of the lead parts. The first chip electrode of the semiconductor chip is electrically connected to the lead part of the flexible substrate by a soldering process. |
