IMAGE SENSOR FABRICATING METHOD

摘要

A method for fabricating an image sensor is provided to increase yield of a chip and improve an optical characteristic by avoiding a crack generated by a micro lens protecting layer when a wafer having an image sensor is sawed along a scribe line. A micro lens pattern is formed on a wafer. A micro lens protecting layer(301) is formed on the resultant structure. The micro lens protecting layer on a scribe region is selectively removed to control generation of crack in the micro lens protecting layer in a subsequent wafer sawing process. The scribe region and a corner of a main chip region are no-chrome processed to selectively etch the micro lens protecting layer.