| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable and thin surface mount light-emitting device for emitting light with high intensity. <P>SOLUTION: The light-emitting device comprises a light-emitting element; a metal package consisting of a recess into which the light-emitting element is stored, and a base having at least one through-hole; and a lead electrode that is electrically separated from the metal package by an insulting member, and is inserted into the through-hole so that the tip projects from the bottom surface of the base. On the bottom surface of the recess that is an outer surface opposite to a surface on which the light-emitting element is placed, the surface of metal for composing the metal package is exposed, and the exposed surface of the metal is in contact with a packaging substrate when mounting on the packaging substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
