| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering iron which can quickly melt the solder in a predetermined portion and is suitable for use in the case where a particularly small mounting component is disposed adjacent to on a substrate without giving rise to such an accident as a damage to the other portion due to useless heating. SOLUTION: In the soldering iron for separating from the substrate 8 the lead pin 7 of the mounting component 6 soldered onto the substrate 8, a pair of projecting pieces 33 are provided at the iron tip 3 which are counterposed with a spacing for interposing the lead pin 7, and at least one of which is formed of a shape-memory alloy deformed so as to be brought into contact with each other at a temperature nearly equal to the melting temperature of solder. COPYRIGHT: (C)2007,JPO&INPIT |
