| 摘要 |
<p>A package (200) for storing and providing supply of beamlead semiconductor devices (202, 204, 206) in a pick-and-place manufacturing process of Application Specific Integrated Circuits, ASICs, wherein the beamlead semiconductor devices (202, 204, 206) are picked directly from said package (200). The package (200) comprises a container part (302) and a lid part (304), said container part (302) comprising plurality of regularly displaced, substantially flat-bottom recesses and said lid part (304) being detachably attached to said container part (302). At least a top surface of said container part (302) is made of electric conductive material and said top surface (400) of said container part (302) is covered with a non-reflective coating and the lid part (304) is transparent in at least these areas, which are located above the recesses.</p> |
