| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate where bonding property of a surface electrode is sufficient and a conductor pattern is not damaged without a soldering defect. <P>SOLUTION: An outer electrode is formed on an upper face of a non-sintered multilayer ceramic substrate where a substrate green sheet is laminated which comprises a ceramic material and can be sintered at a low temperature. A confined layer which is mainly composed of inorganic particles that are not sintered at a sintering temperature of the non-sintered multilayer ceramic substrate is installed to stuck on the upper face, and/or a lower face comprising the outer electrode of the non-sintered multilayer ceramic substrate so as to make an integrated laminated body. The laminated body is sintered at the temperature where the non-sintered multilayer ceramic substrate is sintered. The confined layer is removed. A rate of a metal constituting the inorganic particles remaining on the outer electrode is 0.5 to 20 mass% with respect to a total of a metal constituting the outer electrode and the metal constituting the inorganic particles. Adhesion strength of the outer electrode is 5 N/mm<SP>2</SP>or above. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
