发明名称 |
MULTI-LAYER POLISHING PAD MATERIAL FOR CMP |
摘要 |
The invention is directed to a multi-layer polishing pad (10) for chemical- mechanical polishing comprising a porous polishing layer (12) and a porous bottom layer (14) , wherein the bottom layer (14) is substantially coextensive with the polishing layer (12) , the polishing layer (12) being joined to the bottom layer without the use of an adhesive; the polishing layer (12) having an average surface roughness, Ra, that is greater than the Ra of the bottom layer. |
申请公布号 |
WO2006115924(A1) |
申请公布日期 |
2006.11.02 |
申请号 |
WO2006US14674 |
申请日期 |
2006.04.19 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
PRASAD, ABANESHWAR;LACY, MICHAEL |
分类号 |
B24D3/32;B24B7/30;B24B37/20;B24B37/22;B24D13/14 |
主分类号 |
B24D3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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