FILM SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

A film substrate for a semiconductor package and the semiconductor package having the same are provided to improve a bonding property between a bonding medium and a base film by increasing a bonding area between them. A film substrate for a semiconductor package includes a base film(201), plural leads(202), and plural dummy patterns(204). The leads are formed on a first region of the base film at a predetermined pattern. The leads are electrically connected to a semiconductor die. The dummy patterns are formed on a second region of the base film. The first region is an edge region of the base film, while the second region is a central region, where the semiconductor die is attached to the base film. The dummy patterns electrically insulate the leads from each other. The leads and the dummy pattern are made of copper.