发明名称 |
STRUCTURE OF INSTALLING A PRINTED CIRCUIT BOARD TO THE PANEL |
摘要 |
A structure of installing a printed circuit board on a panel is provided to reduce an error rate by securely performing an injection molding process by not using plural boss units on a rear surface of the panel. A structure of installing a printed circuit board on a panel includes at least one protrusion portion(51) and a coupling portion(41). The protrusion portion is protruded from one side of the PCB(Printed Circuit Board). At least one insertion hole is formed on the coupling portion of a rear surface of the panel. The protrusion portion is inserted into the through-hole. The protrusion portions are formed on upper and lower portions of the PCB. The coupling portions are protruded from upper and lower portions of the rear surface of the panel.
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申请公布号 |
KR20060112352(A) |
申请公布日期 |
2006.11.01 |
申请号 |
KR20050034658 |
申请日期 |
2005.04.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAE, GWANG JO |
分类号 |
H05K7/12 |
主分类号 |
H05K7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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