发明名称 STRUCTURE OF INSTALLING A PRINTED CIRCUIT BOARD TO THE PANEL
摘要 A structure of installing a printed circuit board on a panel is provided to reduce an error rate by securely performing an injection molding process by not using plural boss units on a rear surface of the panel. A structure of installing a printed circuit board on a panel includes at least one protrusion portion(51) and a coupling portion(41). The protrusion portion is protruded from one side of the PCB(Printed Circuit Board). At least one insertion hole is formed on the coupling portion of a rear surface of the panel. The protrusion portion is inserted into the through-hole. The protrusion portions are formed on upper and lower portions of the PCB. The coupling portions are protruded from upper and lower portions of the rear surface of the panel.
申请公布号 KR20060112352(A) 申请公布日期 2006.11.01
申请号 KR20050034658 申请日期 2005.04.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAE, GWANG JO
分类号 H05K7/12 主分类号 H05K7/12
代理机构 代理人
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