CARRYING STRUCTURE OF ELECTRONIC COMPONENTS

摘要

A structure for accommodating electronic components is provided to mount the other components therein to provide more excellent electric functions. In a structure(2) for accommodating electronic components, at least one supporting substrate(25) includes at least one space. At least one component including an active side and a non-active side is arranged inside the space of the supporting substrate(25). At least one adhesive layer(27) is formed on a surface of the supporting substrate(25). The electronic component is fixed to the space of the supporting substrate(25) by allowing a portion of the adhesive layer(27) to fill a gap between the space and the electronic component.