| 发明名称 |
Bonded wafer processing method |
| 摘要 |
According to one embodiment a method is disclosed. The method includes applying a photoresist layer to a first wafer, etching the first wafer, bonding the first wafer to a second wafer and thinning the first wafer; wherein an unsupported bevel portion of the first wafer is removed.
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| 申请公布号 |
US7129172(B2) |
申请公布日期 |
2006.10.31 |
| 申请号 |
US20040811758 |
申请日期 |
2004.03.29 |
| 申请人 |
INTEL CORPORATION |
发明人 |
MORROW PATRICK;LIST R. SCOTT;CHAN MICHAEL Y. |
| 分类号 |
H01L21/302;H01L21/18;H01L21/304;H01L21/762 |
主分类号 |
H01L21/302 |
| 代理机构 |
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